Sr Product Marketing Manager (IC Packaging)

Cadence’s CPG Product Management team is hiring for a Product Marketing Manager focused on product/strategy definition and execution for Electronic Design Automation (EDA) software.  The position will have responsibility of directly driving the success of the Allegro-based IC packaging technologies.

Key responsibilities in this position are:

  • Specializing in fan-out wafer-level packaging technologies, you will establish your technical credibility to become the go-to person for the Cadence advanced IC packaging tools and flows.

  • Based on customer needs, provide in-depth technical assistance in collaboration with R&D to help support advanced design flows for advanced IC packaging

  • Champion the customer needs and work with R&D and WFO to develop competitive and creative technical solutions.

  • Using your hand-on knowledge of the tools and technologies, develop rapid adoption kits for FOWLP packaging technologies.

  • Understand the competitive landscape and continuously work on differentiating Cadence’s solutions.

  • Assist WFO in managing strategic customer evaluations/benchmarks on Cadence’s IC packaging solutions to establish technology differentiation and assert Cadence competitive advantages.

  • Contribute to the creation of technical product literature such as application notes and technical articles.

  • Develop and deliver product demonstrations.

  • Participate in the creation of new products from pricing through release.

Leverage and build your technical expertise in one or more of the following areas:

  • Multi-chip(let) packaging architectures

  • Full-flow, from planning to tape-out for advanced packaging

  • Physical verification tools for package-level sign-off

  • Deep technical understanding of modern IC packaging technologies

Requirements:

  • Bachelor’s degree in Electrical or Computer Engineering or Computer Science or equivalent

  • 5+ years of experience in advanced multi-chip(let) package design and analysis

  • Deep knowledge of Cadence Allegro-based IC packaging solutions

  • Strong verbal and written communication skills in English

  • Up to 30% travel

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